| 摘要 |
The invention relates to an interconnection device (6) between an integrated circuit (1) and an electrical circuit (4), such as a printed circuit. This device (6) comprises, depending upon the desired interconnection, an insulating strip or a plurality of stacked insulating strips. Each one of the strips is traversed by a predetermined number of paths which conduct electricity without offset and by a predetermined, non-zero number of paths which conduct electricity with an offset in the plane of the strip and along a predetermined direction specific to the strip. The device (6) is placed between the active face (12) of the integrated circuit (1) and the electrical circuit (4). The choice of the number of strips of the device, of their respective orientations and of the numbers of paths with and without offset within each strip permits the creation of any correspondence between the pins of the integrated circuit (1) and the connecting points of the electrical circuit (4). …<??>The invention also relates to a process for producing a strip of this device (6). …<IMAGE>… |
