发明名称 COMPOSITION OF POLYMER THICK-FILM RESISTOR
摘要 <p>PURPOSE: To obtain a thick film resistor with stability by using a substance made by dissolving conductive metallic particulates, micro substance particles and thermoplastic resin in organic solvent, the conductive metallic particulates and the micro substance particles having specified surface areas. CONSTITUTION: A thick polymer film resistor composition is produced by dissolving conductive metallic particulates having a surface area from 0.3 to 3.0 m<2> /g, micro substance particles having a surface area greater than 100 m<2> /g, and thermoplastic resin in organic solvent. This thick polymer film resistor composition can substantially cure within 2.5 minutes by heating it to 135 deg.C, and the volume ratio of the granular substance to the resin is at least about 3.5 and the weight ratio of the solvent to the resin is about from 3 to 5. Use of this thick polymer film resistor composition permits a resistor with proper resistive uniformity and stability to be produced.</p>
申请公布号 JPH06196304(A) 申请公布日期 1994.07.15
申请号 JP19930228585 申请日期 1993.09.14
申请人 E I DU PONT DE NEMOURS & CO 发明人 JIEI ROBAATO DOOFUMAN
分类号 H01B1/22;H01C7/00;H05K1/09;(IPC1-7):H01C7/00 主分类号 H01B1/22
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