| 摘要 |
<p>A multi-chip module board (12) includes a multi-chip module substrate; a first multi-chip module (15) designed and assembled into the substrate; and a space on the substrate configured to receive an additional add-on multi-chip module (21), memory module or component module and to operatively connect the add-on module to the first multi-chip module. The first multi-chip module contains integrated and discrete circuit elements necessary to provide basic functionality required by the board user. Space and connecting structure is provided on the module board for the connection of add-on modules which provide additional or peripheral functionality to the board. The connecting structures included on the module board and the add-on modules are designed to permit the attachment of any one of several different function add-on modules to a location on the module board.</p> |
