| 摘要 |
An electronic device cooling system including: a cold plate having a plurality of heat generating semiconductor elements collectively mounted in surface contact thereon so as to transmit heat thereto; and a cooling medium solution circulating circuit through which a fluorocarbon solution serving as a cooling medium is circulated through a radiator, cooling medium solution containing tank and cooling medium flow paths arranged in the cold plate by a circulation pump. The cooling medium solution flow paths are arranged so that the flow paths respectively extend in underlying, confronting relation with rows of semiconductor elements mounted on the cold plate. <IMAGE> |
