发明名称 DIELECTRIC CERAMIC COMPOSITION AND PACKAGE FOR HOUSING SEMICONDUCTOR
摘要 PURPOSE:To obtain a dielectric ceramic composition capable of improving dielectric constant and simultaneously having coefficient of thermal expansion nearly equivalent to that of alumina and a package for housing semiconductor. CONSTITUTION:When a composition formula by mol ratio is expressed by xTiO2-yMgO-zSrO, the composition contains <=0.6 pts.wt. Mn expressed in terms of oxide based on 100 pts.wt. main component in the area surrounded by the following points of A, B, C and D in the Figure: A (100, 0, 0), B (72, 0, 28), C (57, 15, 28) and D (66.7, 33.3, 0).
申请公布号 JPH06191933(A) 申请公布日期 1994.07.12
申请号 JP19920347500 申请日期 1992.12.28
申请人 KYOCERA CORP 发明人 FURUSAWA AKIRA;SATA AKIHITO;KUBOTA TAKESHI;YOMO KUNIHIDE
分类号 C04B35/46;H01B3/12;H01L23/15 主分类号 C04B35/46
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