| 摘要 |
<p>PURPOSE:To bond a panel to a frame and insulate circuit elements and the like by an adhesive layer formed on an inner surface of the panel. CONSTITUTION:In an adhesive layer 3 formed on a panel 7, an adhesion area S1 to a frame 5 is provided in a tacky part 13a for adhesion, and an insulation area S2 opposed to a circuit substrate 2 is provided in a non-tacky insulation part 13b.</p> |
