发明名称 |
High-density packaging for multiple removable electronics subassemblies |
摘要 |
Packaging for an electronics assembly. A base card has a row of elongated slots. A number of individually insertable subassemblies have standoff feet and a pair of offset hooks at their sides. The hooks snap into the slots in such a way that each slot can hold the hooks for four different subassemblies, which are positioned adjacent each other and on both sides of the base card.
|
申请公布号 |
US5329428(A) |
申请公布日期 |
1994.07.12 |
申请号 |
US19930080275 |
申请日期 |
1993.06.21 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BLOCK, TIMOTHY R.;GAIO, DAVID P.;SODERSTROM, RONALD L. |
分类号 |
H05K1/14;G02B6/42;G02B6/44;H01R12/16;H05K3/36;H05K7/14;(IPC1-7):H01R23/68 |
主分类号 |
H05K1/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|