HEAT SINK AND SEMICONDUCTOR LASER

摘要

PURPOSE:To allow downsizing of semiconductor laser by facilitating the angular alignment of a semiconductor laser chip. CONSTITUTION:A heat sink 2 is made of a semiconductor material such as silicon and a PN junction plane 9 is provided internally. Upper face for mounting a semiconductor laser chip 1 has a step structure comprising an upper stage face to be provided with a heat sink upper electrode 8 and a lower stage face to be provided with a heat sink upper electrode 6 wherein a normal mesa inclining face 14 is provided at the border part of upper and lower stage faces. The monitor light emitting edge of the semiconductor laser chip 1 abuts, at the lower side thereof, on the inclining face 14 and the semiconductor laser chip 1 is bonded to the surface of the upper electrode 6 thus conducting angular alignment between the semiconductor laser chip 1 and the heat sink 2. The heat sink 2 functions as a photodiode incorporating a PN junction 9. Monitor light impinging on the inclining face 14 defracts to arrive at the PN junction 9. Monitor light reflected on the inclining face 14 does not return back to the active layer 3.