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发明名称
MULTICHIP MODULE SUBSTRATE
摘要
申请公布号
JPH06188361(A)
申请公布日期
1994.07.08
申请号
JP19920116606
申请日期
1992.05.11
申请人
NEC CORP
发明人
ICHIBA YOSHIKAZU
分类号
H01L21/60;H01L23/36;H01L25/04;H01L25/18;H05K7/20;(IPC1-7):H01L25/04
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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