| 摘要 |
<p>PURPOSE:To provide the title thin film multilayer wiring board discharging the function of avoiding the damage and breakage of an insulating layer by mechanism shock during wire-bonding step, etc., fit for the structure of highly reliable multichip module, etc. CONSTITUTION:Within the title thin film multilayer board with an insulating supporting board 4 whose surface is partly insulated electrically, a conductor wiring layer and an inorganic base insulating layer integrally formed and arranged to be alternately laminated on the main surface of the insulating supporting board 4, a multilayer wiring part 5 incorporating a capacitor comprising from a ground layer 5c to a power supply layer 5a and a bonding pad 6 formed and arranged on a specific area on the surface of the multilayer wiring part 5, a shock resistant buffer material layer 5e is to be inserted and arranged in either inner layer insulating layer 5b between the ground layer 5c and power supply layer 5a comprising the capacitor of the multilayer wiring part 5 and the bonding pad 6.</p> |
