| 摘要 |
PURPOSE:To precisely position a lead frame and enable bonding, by cutting an unnecessary outer frame, in the vicinity of a bonding part, at the same time when a lead part is fused and bonded with a laser machining apparatus. CONSTITUTION:When lead bonding is performed by using an automatic stage 8, it is so moved that the lead bonding part 1 is firstly irradiated with laser light. Next the bonding part 1 is irradiated with laser light by using a laser machining apparatus 2. The bonding part 1 is fused, and the outer frame 9 is sucked by an exhaust pump 3. When the bonding part 1 is solidificated, suction by the exhaust pump 3 is ended, and the bonding part is simultaneously cut. Thereby a plurality of individual lead frames 7 to be laminated can be precisely positioned and bonded, and unnecessary parts are eliminated without increasing the number of processes. |
