| 摘要 |
<p>PURPOSE:To enhance the reliability and the yield of a semiconductor device by a method wherein a thermoset resin bonding material is formed at the bonding face of a base body to a lid body and at the side edge of the lid body, swelling of an internal gas is eliminated as well as production of a through hole. CONSTITUTION:A thermoset resin bonding material 9 is formed at the bonding face of a base body 2 to a lid body 5 and at the whole of the side edge 5A of the lid body 5. The thermoset resin bonding material 9 is formed in such a way that the lid body 5 is placed on the base body 2 and that the base body 2 and the lid body 5 are preheated simultaneously. Thereby, an internal gas between the base body 2 and the lid body 5 is prevented from swellings, production of a through hole is eliminated and it is possible to obtain a semiconductor device whose work is simple and whose reliability is high.</p> |
