JIG FOR VERTICAL-TYPE SEMICONDUCTOR HEAT TREATMENT

摘要

PURPOSE:To improve the temperature follow-up property of a semiconductor wafer and the uniformity of a temperature distribution. CONSTITUTION:A plurality of nearly arc-shaped wafer-holding bodies 10 which are provided with cutout parts on the insertion side of a semiconductor wafer are arranged in a row and fixed on a plurality of support rods which are erected and installed between upper and lower end members. The wafer holding bodies 10 are formed of SiC or Si3N4 by a CVD method. A wafer mounting part 14 is formed as a sheet having a thickness of 100 to 1000mum, and a sheetlike reinforcement part 15 which is extended to the lower part is formed so as to be continued to the wafer mounting part 14.