| 摘要 |
PURPOSE:To dispense with modification work arising from a defective chip carrier and to improve yield of a manufacturing process. CONSTITUTION:Manufacture of a semiconductor device is facilitated by testing a device chip carrier 101 of a semiconductor device prior to integrating the chip. A module test card 102 is formed with a test board 103 and a plurality of test chips 104 mounted on the test board. On the test board connection wirings 110, 111, and 112 are mounted to connect a tester 105. The device chip carrier 101 is tested as its operating condition is simulated by the module test card 102. |
