| 摘要 |
PURPOSE:To improve the fillability of the thick film copper via hole to be formed in an ultra multilayer glass-ceramic wiring board which is widely used for large type electric machines, and to form a highly minute conductive via hole under an intrinsic baking condition by a method wherein the characteristics of conductor powder are properly controlled. CONSTITUTION:In the manufacture of a low-temperature-baked glass-ceramic wiring board having copper as conductive material, conductive powder 2, consisting of copper powder having area/weight ratio of 0.3 to 0.6m<2>/g, 50% value of particle-size distribution of 5.0 to 7.0mum in particle diameter, liquidity index of 70 to 79 and coating amount of oxidation preventing agent of 12 to 17wt.%, is put in the via hole 1a provided on a green sheet 1. |
