| 摘要 |
PURPOSE:To form a thin external electrode with high accuracy by a sputtering method. CONSTITUTION:Conductor films 4, 5, 6 are formed on the whole surface of a chip-shaped element assembly 1 by a sputtering operation, parts, in which external electrodes 8, 8 are to be formed, of the element assembly 1 are covered with a resist 7, the conductor films 4, 5, 6 are etched by excluding a part covered with the resist 7, and the resist 7 is removed. Thereby, it is possible to complete a chip-shaped circuit component in which the conductor films 4, 5, 6, i.e., the external electrodes 8, 8, have been left only at both end parts of the element assembly 1. |
