| 摘要 |
PURPOSE: To provide the package of a glass lead mount solid-state image pickup element capable of simplifying the manufacture process of the package, miniaturizing the package, making it light in weight and reducing the cost. CONSTITUTION: This package of the glass lead mount solid-state image pickup element is constituted so as to respectively projectingly form a plurality of conductive bumps 11 at both side parts of the upper surface of a solid-state image pickup element 12, adhere a double coated adhesive insulation tape 15 to the inner side of the conductive bumps 11, respectively form a plurality of metal lines 13 at both side parts of the bottom surface of glass lead 14, adhere the glass lead 14 on the insulation tape 15, respectively bond the inner side ends of the respective metal lines 13 to the conductive bumps 11 and respectively connect the outer side ends of the respective metal lines 13 to a signal processing terminal on a substrate. |
