| 摘要 |
<p>PURPOSE: To easily produce an electric connection array of high density formed between ceramic carrier and a support circuit board and capable of standing distortion due to uncompatible thermal expansion by depositing solder to a solder column and an I/O pad and melting the solder so as to connect the column to the I/O pad. CONSTITUTION: Solder 24 of a certain quatity is deposited to columns 28, 30, 32 and I/O pads 14, 34, 36 and the columns 28, 30, 32 are brought into contact with the pads 14, 34, 36 by adjusting their positions so that the solder 24 exists between them. Then a structure is heated to melt the solder 24, and after combining the columns 28, 30, 32 with the pads 14, 34, 36, the columns 28, 30, 32 are flattened to a previously determined height to produce the electronically mutually connected structure consisting of the solder columns 28, 30, 32 connected to the I/O pads 14, 34, 36 formed on a substrate 12. The columns 28, 30, 32 preferably have a melting point higher than that of the solder 24.</p> |
