SEMICONDUCTOR DEVICE

摘要

PURPOSE:To provide a semiconductor device of a thinned type having excellent heat radiation in the so-called plastic-sealed semiconductor device in which a semiconductor chip is integrally fixed to a connection lead with a resin package. CONSTITUTION:An unformed surface 11a-2 of an element of a semiconductor chip 11 exposes to outside of a resin package 14, whereby an attempt is made to improve a heat-radiant characteristic of the semiconductor chip 11 and thin a device.