| 摘要 |
The radiation structure includes a buried layer formed on a substrate, an epitaxial layer formed on the buried layer and the substrate layer and isolated by an isolation region, a first oxide layer having a contact hole formed on the epitaxial layer, a first metal forming a contact with an emitter region and a base region through the contact hole, a first metal dummy formed on a portion in which there is no metal line, a second oxide layer having a contact hole formed on the first metal and the first metal dummy, a second metal touching with the first metal through the contact hole formed on the second oxide layer, a second metal dummy formed at a portion in which there is no metal line, and a passivation oxide layer forming a dummy pad so as to expose the second metal dummy, thereby obtaining a compact package.
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