| 摘要 |
PURPOSE:To accurately bring a contact of a socket into contact with an IC body by a method wherein a second contact pad arranged in the outer region of an overlapping part on an IC body is arranged on the outer surface side of a wiring sheet. CONSTITUTION:Each lead 10 formed with lead patterns is closely adhered to a wiring sheet and radiantly extends ranging from a center part of a wiring sheet 6 (an overlapping part on an IC body 4) to a peripheral part. An internal end of the lead 10 reaching the overlapping part has a first contact pad 12 opposing to a contact 11 formed on the surface of the IC body 4, and an external end of the lead 10 reaching the peripheral part of the wiring sheet 6 has a second contact pad 15 opposing to a contact held in the socket body. Namely, in lead patterns, the second contact pad 15 formed in the external end widely expands in the outer region of the IC body 4 to use it for a contact with the contact. Thus, the contact of the socket can suitably come into contact with the IC body 4 via the wiring sheet 6. |
