| 摘要 |
PURPOSE:To enable a multilayer sheets to be laminated while enhancing the productivity of the same by a method wherein the conductor layers on the surface of a board is formed of a wax material containing Ag, Cu, Ti and/or Zr as the component thereof. CONSTITUTION:A die-pad 1, a bonding pad 2 and an input.output and 3 are formed on the surface of a multilayer board having conductive wiring layers inside the board. The pads of the conductor layers on the substrate are made of an active metal containing paste. This active metal containing paste is prepared from silver particles, copper particles, titanium and/or zirconium metallic particles or compound particles blended with an organic binder and an organic agent. This active metal containing paste printed in specific shape is baked in a vacuum or in an inert atmosphere such as argon, etc. Furthermore, during the baking step, the active metals such as titanium or zirconium reacts to aluminum nitride to form the nitride of the active metals at the interface so that the conductive layers and the alimunum nitride on the board surface may couple with one another to form the conductor layers on the board surface. |
