SEMICONDUCTOR DEVICE AND ASSEMBLY METHOD THEREOF

摘要

PURPOSE:To lower a thermal resistance and to enhance the reliability of an element by a method wherein a substance whose thermal conductivity is excellent is liquefied and filled into a gap at the bonding face of an uneven metallized substrate to a semiconductor chip by utilizing a capillary phenomenon. CONSTITUTION:A groove part 3 for electrode isolation is formed in a metallized substrate 1 provided with an electrode pattern 4, an electrode pattern 5 for a semiconductor chip 2 is aligned with it, and a face-down bonding operation is performed. An insulating filler 6 is applied in advance to one part of the groove part at the outside of the semiconductor chip 2. The filler is melted by heating in the bonding operation, it is conveyed in the groove part due to a capillary phenomenon, and a thermal resistance between the semiconductor chip and the metallized substrate is reduced. Since the heat-dissipating property of the semiconductor chip is improved, the reliability of an element can be enhanced.