| 发明名称 |
Leiterbahnaufbau zum Abgleichen der Impedanz einer Signalübertragungsleitung |
| 摘要 |
The signal transmission line comprises a microstrip conductor path (26) relatively insulated from an underlying substrate (12), with two capacitance zones (16) on either side of the transmission line, provided by 2 relatively insulated conductor layers (18,20). The conductor layers are coupled to the corresponding layers (18,20) of the other capacitance zone and a current source voltage and an earth voltage are applied to the respective conductor layers (18,20). USE - For supercomputer system. |
| 申请公布号 |
DE4006282(C2) |
申请公布日期 |
1994.07.07 |
| 申请号 |
DE19904006282 |
申请日期 |
1990.02.28 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA |
发明人 |
WAKIMOTO, HIROTSUGU, YOKOHAMA;KONNO, MITSUO, YOKOHAMA;YOSHIHARA, KUNIO, KAWASAKI |
| 分类号 |
H01L21/3205;H01L21/822;H01L23/52;H01L23/522;H01L27/04;H01P5/08;(IPC1-7):H01L23/522;H01L23/66;H05K1/16;H01P3/08 |
主分类号 |
H01L21/3205 |
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