| 摘要 |
The invention relates to a process for the production of three-dimensional mouldings, especially working models, casting patterns and dies in mould-building, by stereolithography and to a three-dimensional moulding produced by this process. According to the invention, in this process, pulverulent materials are applied to a photographic semiconductor by means of electrostatic forces, Figure 2 1 and 2, the mould material is transferred from the photographic semiconductor onto a workpiece carrier, Figure 2 12, then further layers are applied and, after each individual layer has been applied, are fixed or all the layers are fixed together and/or reprocessed. <IMAGE>
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