| 摘要 |
The laser diode chip separating device includes a stage elastically installed by a tensile member and on which a loading portion is formed to have a bar-shaped chip, and a plurality of through-holes are formed at the same interval as the separation line of the bar-shaped chip, a plurality of cutters installed on a base to coincide with the through-holes, and a pressing member for applying force to the bar-shaped chip placed on the stage loading portion to lower the stage.
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