Actinic-radiation-curing hot-melt pressure-sensitive adhesive composition.

摘要

There is disclosed an actinic-radiation-curing, hot-melt pressure-sensitive adhesive composition, which comprises a mixture in a limited mixing ratio of an acrylic high-molecular-weight polymer that is made up of main chain having a molecular weight of 8,000 to 100,000 and a glass transition temperature of -75 to -20 DEG C, and branched chain, in which the main chains and/or branched chains have or at least one ethylenically unsaturated group; and a low-molecular-weight polymer having a molecular weight of 500 to 8,000 and a glass transition temperature of lower than 100 DEG C, which polymer has or does not have an ethylenically unsaturated group in the molecule.