Low surface tension sulfuric acid composition

摘要

PCT No. PCT/JP90/00345 Sec. 371 Date Nov. 15, 1991 Sec. 102(e) Date Nov. 15, 1991 PCT Filed Mar. 15, 1990 PCT Pub. No. WO90/10730 PCT Pub. Date Sep. 20, 1990.Sulfuric acid or sulfuric acid/hydrogen peroxide cleaning solutions used in semiconductor manufacturing processes are improved in wettability and cleaning effect by lowering their surface tension through the addition of surface-active agents Of the general formula R1SO2NR2C2H4OA(I) wherein R1 stands for a fluoroalkyl group, R2 for H or a lower alkyl group and A for H or SO3H.