发明名称 High purity cleaning system
摘要 PCT No. PCT/JP91/00002 Sec. 371 Date Sep. 4, 1992 Sec. 102(e) Date Sep. 4, 1992 PCT Filed Jan. 7, 1991 PCT Pub. No. WO91/11021 PCT Pub. Date Jul. 25, 1991.A method of cleaning under high temperature and high pressure and cleaning equipment to be used in a cleaning process now being employed in such industrial fields as the electronics industry centering around the semiconductor industry and the optical machine industry. The high temperature/high pressure cleaning equipment has at least a compressing pump, a heating device, a nozzle, and piping, and, in the cleaning equipment to inject high temperature/high pressure water from a nozzle to the matter to be cleaned, functions to inject high temperature/high pressure ultrapure water from the nozzle to the matter to be cleaned. Cleaning is carried out by injecting ultrapure water having a relative resistance of 17.0 M/l-cm or more when converted at 25 DEG C. to a matter to be cleaned.
申请公布号 US5326035(A) 申请公布日期 1994.07.05
申请号 US19920867692 申请日期 1992.09.04
申请人 OHMI, TADAHIRO 发明人 OHMI, TADAHIRO;KAWAKAMI, MICHIYA;YAGI, YASUYUKI;OHWADA, MAKOTO;TAKAHARA, KIYOSHI
分类号 H01L21/304;B08B3/02;H01L21/00;H01L21/306;(IPC1-7):B05B1/24 主分类号 H01L21/304
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