发明名称 Solder bumping of integrated circuit die
摘要 A method for forming a solder bump on an integrated circuit die utilizes a terminal (12) formed of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder. The terminal comprises a bond pad (24) overlying a passivation layer (20) on the die and a runner section (26) connecting the bond pad to a metal contact (16). The terminal is applied to the die, for example, as an ink by screen printing, after which a body of solder alloy is reflowed in contact with the bond pad to form the bump. A preferred material for the terminal is composed of silver-plated copper particles and a resol type phenolic binder.
申请公布号 US5327013(A) 申请公布日期 1994.07.05
申请号 US19930091937 申请日期 1993.07.15
申请人 MOTOROLA, INC. 发明人 MOORE, KEVIN D.;MISSELE, CARL
分类号 B05D7/00;C23C26/00;H01L21/60;H01L23/485;H05K3/34;(IPC1-7):H01L23/48;H01L29/40;H01L29/44;H01L29/52 主分类号 B05D7/00
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