| 摘要 |
PURPOSE:To obtain the subject resin paste having excellent quick curability, bond strength at high temperature and stressrelaxation property and useful for IC, etc., by using a respectively a specific epoxy resin, a specific silane compound, bisphenol F, a latent amine compound, an organic borate and silver powder as essential components. CONSTITUTION:This resin paste contains, as essential components, (A) a bisphenol-type epoxy resin, (B) preferably 2-100wt.% (based on the component A) of bisphenol F, (C) preferably 0.1-10wt.% of a latent amine compound such as adipic acid dihydrazide, (D) preferably 5-200wt.% (based on A+B+C) of a silane compound of formula (R1 is aliphatic or aromatic functional group having epoxy group; R2 is alkoxy; R3 is alkyl or alkoxy), e.g. gamma- glycidoxypropyltrimethoxysilane, (E) preferably 0.1-20wt.% (based on A+B+C) of an organic borate salt and (F) preferably 50-90wt.% (in the total paste) of silver powder. |
