| 摘要 |
A semiconductor package comprising a semiconductor chip received in and attached to a cavity of a base made of a ceramic or aluminum, by means of an adhesive, a lid fixedly attached to the upper surface of the semiconductor chip, the lid having a plurality of solder bumps being in contact with bonding pads of the semiconductor chip and a plurality of metal contacts formed on the solder bumps of the lid. The lid comprises an insulating polyimide film or a rectangular plate made of a nonconductive ceramic material. The semiconductor package eliminates the use of a lead frame and metal wires, thereby enabling the manufacture thereof to be simplified. It also achieves a simplification, a lightness, a thinness, a compactness in construction. With the simplified construction, a reduction in manufacture cost and an improvement in productivity are achieved. In manufacturing semiconductor devices, the semiconductor package also provides an improvement in the degree of dense integration.
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