| 摘要 |
A flat package piezoelectric oscillator, sealed with resin, and having leads or terminals includes an IC chip mounted on one side of an island portion of a lead frame, and a piezoelectric oscillator element mounted on an opposite side of the island portion. The resin package of the oscillator has at least one hole through one of opposite surfaces of the package. An injection hole for resin injection is provided along a diagonal line extending between diametrically opposed corners of the resin package, and a cylindrical case of the piezoelectric crystal oscillator element is located such that its longitudinal axis is aligned with the diagonal line to within a range from -45 DEG to +45 DEG . The connection portions of lead terminals for the piezoelectric oscillator element and the pads of the IC chip are located adjacent to the diagonal line. The fabrication of the piezoelectric crystal oscillator is completed by sealing the above described structure with resin.
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