Hot melt adhesive composition that melts at relatively low temperatures

摘要

Novel lower temperature hot melt adhesive and coating composition that melts at temperatures less than 190 DEG F. (about 87.8 DEG C). This composition has a sufficient modulus to bind ophthalmic lenses to metal blocks during grinding processes. The composition also exhibits low melt viscosity and may be mechanically removed without leaving significant residue. Composition comprises a resin, a tackifier, a wax (generally with a molecular weight less than 600), and an optional stabilizer.