HF screening method for PCB

摘要

In the high frequency screening method the circuit and/or circuit element on th circuit board to be screened are covered with a coating (UZ). The coating is produced by covering the circuit and/or circuit element with a first insulating layer (EIS) e.g. rubberising or lacquer, in a first step. A second electrically conductive layer (ELS) e.g. silverised lacquer or graphite or nickel, is applied in a second step. The first and second layers may be produced by spraying.