发明名称 |
Chipkondensator und Verfahren zur Herstellung. |
摘要 |
<p>In a chip type capacitor, the capacitor is accommodated in a sheathing frame 2 having the receiving space compatible with the external dimensions of the capacitor. Terminals 3 which extend from the open end frame 2 are bent along the top surface of the frame 2 and a solderable metal layer e.g. 7 is arranged in a part of the top surface thereof, to facilitate soldering to a circuit board.</p> |
申请公布号 |
DE68915470(D1) |
申请公布日期 |
1994.06.30 |
申请号 |
DE1989615470 |
申请日期 |
1989.03.07 |
申请人 |
NIPPON CHEMI-CON CORP., OME, TOKIO/TOKYO |
发明人 |
ANDO, SUSUMU, OME-SHI TOKYO 198;HAGIWARA, IKUO, OME-SHI TOKYO 198 |
分类号 |
H01G2/06;H01G4/224;H05K3/34;(IPC1-7):H01G1/035 |
主分类号 |
H01G2/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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