发明名称 Method and apparatus for sticking an insulating film to a lead frame
摘要 <p>A method for punching an insulating film is composed of using plural divided punches having a clearance between each two of the divided punches. The clearance absorbs thermal expansion of the divided punches caused by receiving a heat from a heater. A punched insulating film is stuck to a lead frame by being pressed between the divided punches and the heater.</p>
申请公布号 GB9409535(D0) 申请公布日期 1994.06.29
申请号 GB19940009535 申请日期 1994.05.12
申请人 HITACHI CABLE LIMITED 发明人
分类号 H01L21/00;H01L21/48;H01L23/495 主分类号 H01L21/00
代理机构 代理人
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