Hybrid circuit.

摘要

A low thermal resistance flip chip (14) includes a backplate/heat sink (10) underlying a ceramic substrate (16) . An adhesive joint (20) is formed between the ceramic substrate (16) and the backplate/heat sink (10). A hybrid circuit is formed on the ceramic substrate (16) and includes an integrated circuit flip chip (14) having a first set of bumps (22) for electrical connection between the integrated circuit and the flip chip (14). A second set of bumps (thermal bumps) (26) are provided for dissipating heat from the flip chip (14). The thermal bumps (26) are electrically isolated from the flip chip by a thin dielectric/passivation layer (24). A thermally conductive epoxy (28) fills the gap between the flip chip (14) and ceramic substrate (16). A thermal gel blob top (30) is provided on top of the flip chip (14) to provide improved heat dissipation in the lateral or x/y directions.