PROCESS AND DEVICE FOR POSITIONALLY PRECISE SOLDERING OF PARTS TO BE SOLDERED ON A SUPPORTING PLATE.

摘要

The production of character generators for non-mechanical printers requires the positionally precise soldering of light-emitting diode chips (LEDs) on module plates. The precision required in all three dimensions lies between +/- 3 and 10 mu m. A new device is composed of an adjusting device (4) and a soldering device separable therefrom that can carry out as a separate unit a soldering operation. A LED-row to be soldered on a module plate is temporarily adjusted and held on an auxiliary carrier (5) and brought during the soldering operation towards the solder-coated surface of the module plate (carrier (6)) in such a way that the components being soldered are joined only after the solder (2) has melted. For that purpose, spring joints which can be blocked in two predetermined positions and also intermediate fusible disks which melt shortly after the solder (2) on the module plate are used, allowing the joining of the components being soldered to be controlled. As a result, mechanical damage to the LED-rows are avoided and a highly precise positioning of the LED-rows and the module plate is obtained.