| 摘要 |
A printed wiring board is selectively covered with solid solder resist pattern implemented by a first solder resist sub-pattern formed from liquid photo-sensitive solder resist and a second solder resist sub-pattern formed from photo-sensitive fry films, and a first area with pads and a second area with a through-hole or via-hole are respectively covered with the first solder resist sub-pattern and the second solder resist sub-pattern so that any peeling of the first solder resist sub-pattern and any residue of the liquid photo-sensitive solder resist in the through-hole or via-hole never take place.
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