| 摘要 |
PCT No. PCT/FR92/00241 Sec. 371 Date Nov. 10, 1992 Sec. 102(e) Date Nov. 10, 1992 PCT Filed Mar. 17, 1992 PCT Pub. No. WO92/17905 PCT Pub. Date Oct. 15, 1992.An object of the invention is the production of coaxial connections for the input/output links of the component and/or of the housing which encapsulates it. More precisely, the component placed in a package (B), is conventionally connected by wires to its package; the wires are next covered by a first insulating layer (21) then by a second conducting layer (24) in such a way that this second layer is linked to the earth pads (PE1) of the package. The layers (21, 24) thus form collectively-produced coaxial structures with the connection wires (F). A similar process is used for the input/output connections (P) of the package itself.
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