发明名称 Modular backplane
摘要 A flexible backplane assembly is provided wherein removable backplane modules are mounted in a platform in a manner such that the backplane modules may be removed and replaced to accommodate different types of circuit modules. Coacting guides are provided on the platform and the backplane modules to define a travel path for module insertion and removal which prevents contact with adjacent circuit and backplane modules and maneuvers around platform structural members. Connectors at the rear of each backplane module for mating withy circuit module connectors may be electrically connected to I/O boards at the front of the module to permit wiring of the backplane modules from the front of the platform.
申请公布号 US5325270(A) 申请公布日期 1994.06.28
申请号 US19920890693 申请日期 1992.05.29
申请人 TELCO SYSTEMS, INC. 发明人 WENGER, GARY T.;MOORE, RICHARD B.;LANE, JR., JAMES J.;CHASTAIN, DAVID;STARK, JAMES;PEDRAZA, LOUIS
分类号 H05K7/14;(IPC1-7):H05K7/00;H05K7/16 主分类号 H05K7/14
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