METHOD FOR PEELING RESIN PLATE AND MOLDING PLATE

摘要

PURPOSE:To provide a method peeling reliably a resin plate stuck to a molding plate from the molding plate. CONSTITUTION:At the time of peeling of a resin plate 1 from a molding plate 2 which has higher rigidity than that of the resin plate 1 and when a claw 5 is raised by following a rise of a suction pad 4 while raising the resin plate 1 by the rise of the suction pad 4 by attracting an end part of the top of the resin plate 1 by the suction pad 4 and inserting the claw 5 between the resin plate 1 and molding plate 2 from the side, the center of the top of the resin plate 1 is pressed by a pressing shaft 3.