发明名称 RESIN SEALING MOLD FOR ELECTRONIC PART
摘要 PURPOSE:To improve a releasability of a resin sealing mold from a cured resin by a method wherein the surface of the mold is modified by an ion injection method. CONSTITUTION:In a resin sealing mold, resin seal molding is conducted using molds 1, 2 provided with releasing layers 15, which are formed by injecting nickel ions on surface layers of mold surfaces at least at a part contacting to a cured resin, or using molds 1, 2 made of a carbon-containing molding material and provided with pseudo-Teflon layers, which are formed by injecting fluorine ions on surface layers of mold surfaces at least at a part contacting to a cured resin.
申请公布号 JPH06179218(A) 申请公布日期 1994.06.28
申请号 JP19920354020 申请日期 1992.12.14
申请人 TOOWA KK 发明人 KAWAMOTO YOSHIHISA
分类号 B29C33/12;B29C33/38;B29C45/02;B29C45/26;B29L31/34;(IPC1-7):B29C33/38 主分类号 B29C33/12
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