| 摘要 |
PURPOSE:To better radiation, by sealing a semiconductor element chip to a ceramic laminating type lead-less package, and by ensuring connection with a wiring substrate by mounting a conductor terminal for external connection at the wire bonding surface side in a shape that is higher than an upper surface of the package. CONSTITUTION:A LSI chip 10 is connected onto a metallized portion 5, which is plated with gold, of a ceramic laminating type package 1, and pads on LSI wiring and metallized patterns 6 are bonded by means of gold wires 11. A cover 12, which coefficient of thermal expansion is closely resemble to ceramics, is connected onto a metallized portion 7, and seals the portion. When the cover 12 is mounted and the package is completed, the upper surface is located at the side lower than a surface of an electrode 8 installed being connected to a through hole metallized portion 9. The package is joined in a lead-less shape while directing the electrode 8 to a lower surface and opposing it to a wiring electrode 14 of a wiring substrate 15. A LSI is efficiently radiated from the back of the package positioned at a surface opposite to the wiring substrate 15. Radiation fins 10 may be mounted. |
