| 摘要 |
PURPOSE:To decrease inductance by improving heat dissipating effect with a heat conducting plate provided between a base material and a cap and by providing a bondable metallic member between the base material and the cap. CONSTITUTION:A heat conducting plate 12 is adhered on a semiconductor chip 4, and the top face on a cap 9. The bottom of a nonmagnetic metal plate is adhered on the semiconductor chip 4 with a nonconductive adhesive 11, and the top face on a metal cap with a conductive adhesive 21. Further, the base material is connected to pads on the semiconductor chip 4 with bonding wires 6. This design improves heat dissipating effect of a semiconductor device, so that a package cooling member 15 can be reduced as well as the whole system. Further, the malfunction of the semiconductor device can be prevented by a decrease in inductance. |
