| 摘要 |
<p>PURPOSE:To improve portability and strength against bending or shock by planarly arranging a thin type IC module and a thin coil for reception, interposing a plastic film between both these planes, further holding them therebetween with a plastic surface member from both planes and fixedly integrating them by heating and thermocompression bonding. CONSTITUTION:A thin type IC module 11 and a thin coil 12 for reception/ transmission are planarly arranged without being overlapped. On the other hand, a plastic film 14 is interposed between both faces of these thin type module 11 and thin coil 12 for reception/transmission. Further, they are held therebetween from both faces with a plastic surface member 15 and fixedly integrated by heating and pressing so as to be made into a thin card. Thus, both portability and strength against bending or shock can be improved. Moreover, the thin type IC module 11 and the thin coil 12 for reception/transmission are surely interrupted from an outside, and these module 11 and coil 12 can be prevented from being damaged.</p> |
