| 摘要 |
<p>PURPOSE:To provide a method of manufacturing an electronic component mounting board, wherein a power supply line and a GND line can be reduced in inductance, and the board can be enhanced in degree of freedom of design and lessened in cost dispensing with a press process. CONSTITUTION:A power supply layer 3 and a power supply lead 7 are electrically connected together through the intermediary of a lead connector 3a provided to the periphery of a printed wiring board P, and a GND layer 4 and a GND lead 8 are also electrically connected together through the intermediary of a lead connecting pad 4b provided to the periphery of a printed wiring board P. Therefore, a power supply lead 7 and a grounding lead 8 large in inductance are lessened in length, so that a power supply line and a GND line are reduced in inductance. The power supply layer 3 and the GND layer 4 are formed on the printed wiring board P, so that they can be enhanced in degree of freedom of design when they are formed. As printed wiring boards P each provided with the power supply layer 3 and the GND layer 4 are manufactured through a multiple unit forming method, the board P can be lessened in cost dispensing with a press process.</p> |
