| 摘要 |
PURPOSE:To achieve that a paste in a uniform amount is applied to electronic components by a method wherein protrusion parts toward lower parts of the electronic components supported by through holes in a support body are pressed to a reference plane body. CONSTITUTION:In a state that electronic components 3 have been supported inside through holes 2 in a support body 1, protrusion parts toward lower parts of the through holes 2 of the electronic components 3 are pressed to a reference plane body 8, and a protrusion amount L2 is made definite. After that, the reference plane body 8 is coated with a paste 9. Then, the protrusion parts toward the lower parts of the electronic components 3 whose protrusion amount L2 has been made definite are immersed in the paste 9, and a paste 9a is applied to them. When a proximity speed in the coating operation of the paste 9 to the electronic components 3, i.e., a speed in a coating and immersion operation, is fast, the paste acts as if it were a hard paste due to the thixotropy of the paste 9, a force which exceeds a static frictional force holding the electronic components 3 acts, and the electronic components 3 are moved. The electronic components 3 can be fixed and held well when the paste is moved slowly. |
