BONDING WIRE INSPECTION DEVICE

摘要

PURPOSE:To provide a device capable of more accurately inspecting a bonding wire. CONSTITUTION:The bonding state between a semiconductor chip 202 and a lead frame 201 is photographed by an image pickup device 205 and inspected by image processing. The three-dimensional inclination of the lead frame 201 and the semiconductor chip 202 against the reference face is measured. The focal position of the image pickup device 205 is adjusted in response to the measured result, and an image in focus can be obtained.